Patent · US Active

Cleaning method for thin-film processing applications and apparatus for use therein

US9534294B2 · kind B2 · utility

1Cited by

1References

12Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Florian RIES · Stuttgart, DE
Stefan Hein · Berlin, DE
Stefan Lorenz · Obertraubling, DE
Neil MORRISON · Seeheim-Jugenheim, DE
Tobias Stolley · Oberursel, DE

Key dates

Filing date	Aug 13, 2013
Grant date	Jan 3, 2017
Priority date	—
Expiry date	Mar 17, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/192
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.