Flip chip bonder and flip chip bonding method
US9536856B2 · kind B2 · utility
2Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Sep 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3701
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.