Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips
US9537199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2015 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Mar 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.