Package assembly for thin wafer shipping and method of use
US9543175B2 · kind B2 · utility
4Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2013 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Dec 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.