Damyon L. Corbin
7Patents
2h-index
10Co-inventors
40Inventor score
Filing activity: Jan 10, 2013 → Sep 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9543175B2 | Package assembly for thin wafer shipping and method of use | Electricity | 4 | Active |
| US10090180B2 | Package assembly for thin wafer shipping and method of use | Electricity | 3 | Active |
| US10468280B2 | Package assembly for thin wafer shipping and method of use | Electricity | 2 | Active |
| US8912091B2 | Backside metal ground plane with improved metal adhesion and design structures | Electricity | 1 | Active |
| US10784137B2 | Package assembly for thin wafer shipping and method of use | Electricity | 0 | Active |
| US10622235B2 | Package assembly for thin wafer shipping and method of use | Electricity | 0 | Active |
| US10192748B2 | Controlling of etch depth in deep via etching processes and resultant structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.