Semiconductor package and fabricating method thereof
US9543242B1 · kind B1 · utility
50Cited by
232References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Aug 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.