Multi-device package and manufacturing method thereof
US9543270B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip, a plurality of first connectors and a conductive contact. The two device regions are formed from the substrate, and the substrate has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface and electrically connected to the two device regions, and the external chip is disposed on the first redistribution layer. The first connectors are interposed between the first redistribution layer and the external chip to interconnect the first redistribution layer and the external chip, and the conductive contact is extended from the second surface to the first surface of the substrate to electrically connect the device region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.