Inventor · Taipei, TW

Yi-Jen Lo

23Patents
2h-index
11Co-inventors
50Inventor score

Filing activity: Dec 7, 2005 → Oct 23, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9576933B1 Fan-out wafer level packaging and manufacturing method thereof Electricity 3 Active
US10818508B2 Semiconductor structure and method for preparing the same Electricity 2 Active
US9543270B1 Multi-device package and manufacturing method thereof Electricity 2 Active
US9748106B2 Method for fabricating semiconductor package Electricity 1 Active
US10593637B2 Multi-device packages and related microelectronic devices Electricity 1 Active
US7341950B2 Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers Electricity 1 Expired
US11842979B2 Semiconductor device and method of manufacturing the same Electricity 1 Active
US12266622B2 Method of manufacturing semiconductor structure having hybrid bonding pad Electricity 0 Active
US12400951B2 Semiconductor device and method of manufacturing the same Electricity 0 Active
US12278211B2 Manufacturing method of semiconductor device Electricity 0 Active
US10373922B2 Methods of manufacturing a multi-device package Electricity 0 Active
US11631656B2 Method for manufacturing semiconductor structure Electricity 0 Active
US10811382B1 Method of manufacturing semiconductor device Electricity 0 Active
US11482474B2 Forming a self-aligned TSV with narrow opening in horizontal isolation layer interfacing substrate Electricity 0 Active
US12295137B2 Method of manufacturing tsemiconductor device having bonding structure Electricity 0 Active
US8003528B2 Semiconductor structure and method for making the same Electricity 0 Active
US12293982B2 Semiconductor structure having hybrid bonding pad Electricity 0 Active
US11488840B2 Wafer-to-wafer interconnection structure and method of manufacturing the same Electricity 0 Active
US11610878B1 Semiconductor device with stacked chips and method for fabricating the same Electricity 0 Active
US10679958B2 Methods of manufacturing a multi-device package Electricity 0 Active
US11211351B2 Apparatuses including redistribution layers and related microelectronic devices Electricity 0 Active
US11342307B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US11876077B2 Semiconductor device and method of manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.