Adhesive tape for encapsulating an organic electronic arrangement

US9543549B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Minyoung Bai · Hamburg, DE
• Jan Ellinger · Hamburg, DE
• Judith Grünauer · Hamburg, DE
• Klaus Keite-Telgenbüscher · Hamburg, DE
• Anika PETERSEN · Heidmühlen, DE

Key dates

• Filing date: May 27, 2013
• Grant date: Jan 10, 2017
• Expiry date: Jul 23, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/549
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.