Hermetically sealed electronic device using solder bonding
US9545682B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2015 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Nov 4, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.