Pressure sensor and packaging method thereof
US9546089B1 · kind B1 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2015 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
According to an embodiment of the present invention, a pressure sensor includes: a pressure sensing chip, which includes a substrate, a sensing film, an insulation layer and a first bonding pad; wherein the sensing film is on the substrate, and a sagging step is formed at one side of the substrate; the insulation layer is prepared on the sensing film and the substrate; the first bonding pad is prepared on the insulation layer on a bottom surface of the step, and is connected to the region of the substrate close to the sensing film via a lead wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.