Apparatus for treating surfaces of wafer-shaped articles
US9548223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Jun 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.