Reduced expansion thermal compression bonding process bond head
US9548284B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 18, 2013 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Feb 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.