Integrated circuit die decoupling system with reduced inductance
US9548288B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Jan 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system that includes an integrated circuit die and a power supply decoupling unit is disclosed. The system includes an integrated circuit die, and interconnection region, and a decoupling unit. The integrated circuit die includes a plurality of circuits, which each include multiple devices interconnected using wires fabricated on a first plurality of conductive layers. The interconnection region includes multiple solder balls, and multiple conductive paths, each of which includes wires fabricated on a second plurality conductive layers. At least one solder ball is connected to an Input/Output terminal of a first circuit of the plurality of circuits via one of the conductive paths. The decoupling unit may include a plurality of capacitors and a plurality of terminals. Each terminal of the decoupling unit may be coupled to a respective power terminal of a second circuit of the plurality of circuits via the conductive paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.