DIMM connector region vias and routing
US9548551B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2015 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Aug 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.