Cleanability assessment of sublimate from lithography materials
US9551696B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Jun 23, 2014 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Apr 2, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N1/44
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing the cleanability of polymerized sublimate outgassed from a lithography material during a thermal heating process including; placing a wafer on a wafer hotplate inside a chamber with the wafer being covered by a lithography material; placing a target, having a starting composition, above the wafer in the chamber; heating the wafer using the wafer hotplate in an attempt to outgas a sublimate, where the sublimate condenses on the target; forming a polymerized sublimate on the target; and applying organic solvents to the target to determine the cleanability of the polymerized sublimate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.