Substrate processing device and substrate processing method
US9553003B2 · kind B2 · utility
4Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Mar 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.