Bonding apparatus and substrate manufacturing equipment including the same
US9553069B2 · kind B2 · utility
6Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Sep 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.