Sukwon Lee
8Patents
2h-index
22Co-inventors
47Inventor score
Filing activity: Oct 24, 2012 → Mar 30, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9553069B2 | Bonding apparatus and substrate manufacturing equipment including the same | Electricity | 6 | Active |
| US10312196B2 | Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance | Electricity | 2 | Active |
| US11607741B2 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Electricity | 1 | Active |
| US8835503B2 | Pharmaceutical composition containing GLUR2-lacking AMPAR antagonist for preventing or treating psychiatric illnesses | Human Necessities | 0 | Active |
| US11626381B2 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Electricity | 0 | Active |
| US11239177B2 | Semiconductor packages including die over-shift indicating patterns | Electricity | 0 | Active |
| US10692816B2 | Semiconductor packages including die over-shift indicating patterns | Electricity | 0 | Active |
| US11848301B2 | Method of manufacturing a semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.