Molding material for package
US9553284B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2014 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | May 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.