Printed circuit board and method of manufacturing the same
US9554466B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.