Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same
US9556061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Aug 28, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed is an Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from Y2O3, La2O3, CeO2, Er2O3, and Yb2O3 in a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of Y2O3 and La2O3 in a total content of 0.1 to 1.0 mole percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.