Mechanisms for forming hybrid bonding structures with elongated bumps
US9559071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jun 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of mechanisms for forming a package structure are provided. The package structure includes a semiconductor die and a substrate. The package structure includes a pillar bump and an elongated solder bump bonded to the semiconductor die and the substrate. A height of the elongated solder bump is substantially equal to a height of the pillar bump. The elongated solder bump has a first width, at a first horizontal plane passing through an upper end of a sidewall surface of the elongated solder bump, and a second width, at a second horizontal plane passing through a midpoint of the sidewall surface. A ratio of the second width to the first width is in a range from about 0.5 to about 1.1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.