Light-emitting package structure and method of fabricating the same
US9559273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Mar 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
Abstract
A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.