Integrated circuit cooling using embedded peltier micro-vias in substrate

US9559283B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Jeffrey P. Gambino · Gresham, US
• Richard S. Graf · Gray, US
• Sudeep Mandal · Bengaluru, IN

Key dates

• Filing date: Mar 30, 2015
• Grant date: Jan 31, 2017
• Expiry date: Mar 30, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N10/01

Abstract

A semiconductor device package and method for manufacturing the same, includes a semiconductor substrate including a plurality of embedded thermoelectric couples. The embedded thermoelectric couples can be in trenches and extend partially into the substrate from the handle side of the substrate. An n-type pillar and a p-type pillar are electrically connected using a conducting contact plate to form each of the partially embedded thermoelectric couples. A series connection layer electrically connects the plurality of thermoelectric couples on the handle side. A power source provides electrical current to the series connection layer allowing current to flow through the plurality of the series connected thermoelectric couples. A heat sink is positioned adjacent to the connected thermoelectric couples for transferring heat away from the device side to the heat sink using the thermoelectric couples.