Multilayer circuit substrate having core layer with through-hole
US9560743B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Apr 29, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Oct 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit substrate obtained by alternately stacking conductor layers and insulator layers. The conductor layers include a core layer having a greater thickness than any of the other conductor layers and located in an inner layer of the multilayer circuit substrate. A first conductor layer facing the core layer through an insulator layer has first signal wires that transmit high frequency signals, and through-holes are formed in the core layer along the first signal wires in a location facing the first signal wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.