Stress relief for rigid components on flexible circuits
US9560746B1 · kind B1 · utility
4Cited by
25References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Apr 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.