Electronic device with plated electrical contact
US9563233B2 · kind B2 · utility
1Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2014 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Aug 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/03
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.