Plastic cooler for semiconductor modules

US9564384B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Inpil Yoo · Unterhaching, DE
• Andreas Grassmann · Villach, AT

Key dates

• Filing date: Mar 3, 2015
• Grant date: Feb 7, 2017
• Expiry date: Mar 3, 2035

Classification

• Technology area (CPC —): General

Abstract

A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.