Security mesh and method of making
US9565777B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2015 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Dec 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.