Patent · US Active

Micromechanical component

US9567212B2 · kind B2 · utility

1Cited by
4References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 24, 2013
Grant dateFeb 14, 2017
Priority date
Expiry dateOct 24, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2203/035
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.