Micromechanical component
US9567212B2 · kind B2 · utility
1Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2013 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Oct 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.