Polishing slurry and substrate polishing method using the same
US9567490B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Oct 20, 2014 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry for tungsten and a substrate polishing method are disclosed. The polishing slurry includes an abrasive for performing polishing and having positive zeta potential, and a potential modulator for promoting the oxidation of the tungsten and for controlling the zeta potential of the abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.