Component and chip assembly structure for high yield parallelized fiber assembly
US9568682B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2016 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Feb 8, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4243
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.