Patent · US Active

Automated image-based process monitoring and control

US9569834B2 · kind B2 · utility

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12Claims
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Assignee

Inventors

Key dates

Filing dateJun 22, 2015
Grant dateFeb 14, 2017
Priority date
Expiry dateJun 22, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06T2207/30148
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.