Dielectric grid bottom profile for light focusing
US9570493B2 · kind B2 · utility
9Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Apr 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8067
Abstract
A back side illumination (BSI) image sensor with a dielectric grid opening having a curved lower surface is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid is arranged over the pixel sensor and defines a sidewall of a metallic grid opening. A dielectric grid is arranged over the metallic grid and defines a sidewall of the dielectric grid opening. A capping layer is arranged over the metallic grid, and defines the curved lower surface of the dielectric grid opening. A method for manufacturing the BSI image sensor is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.