Method for manufacturing the magnetic field sensor module

US9570676B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stefan Kolb · Unterschleißheim, DE
• Klemens Pruegl · Regensburg, DE
• Juergen Zimmer · Neubiberg, DE

Key dates

• Filing date: Jul 21, 2016
• Grant date: Feb 14, 2017
• Expiry date: Jul 21, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N59/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator arrangement is provided, wherein a semiconductor circuit arrangement is integrated adjacent to a main surface of the semiconductor substrate into the same, wherein the metal-insulator arrangement is arranged on the main surface of the semiconductor substrate and comprises a structured metal sheet and insulation material at least partially surrounding the structured metal sheet, wherein the structured metal sheet is electrically connected to the semiconductor circuit arrangement. Then, a magnetoresistive sensor structure is applied onto a surface of the insulation material of the composite arrangement, and finally an electrical connection between the magnetoresistive sensor structure and the structured metal sheet is established, so that the magnetoresistive sensor structure is connected to the integrated circuit arrangement.