Coating apparatus and method of forming coating film
US9573144B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Feb 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of forming a coating film over a substrate is provided. The method includes spinning the substrate. The method further includes providing a central coating liquid spray over a central portion of the substrate. The method also includes providing first coating liquid sprays over the substrate. The first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by a same first distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.