Aromatic tetrafunctional vinylbenzyl resin composition and use thereof
US9574070B2 · kind B2 · utility
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2References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 4, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Jun 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.