Wafer or reticle thermal deformation measuring techniques
US9574875B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively. Based on the plurality of temperature measurements, a controller is adapted to determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.