Testing stacked devices
US9575117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2013 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.