Apparatus, method, and composition for far edge wafer cleaning
US9576789B2 · kind B2 · utility
2Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2013 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Jan 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.