Composition for electronic device
US9576871B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | May 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.