Multi-strike process for bonding
US9576929B1 · kind B1 · utility
7Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2016 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Jan 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.