Semiconductor device and method of manufacturing the same
US9576973B2 · kind B2 · utility
12Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/037
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semiconductor device, including: stack structures including interlayer insulating patterns and conductive line patterns, which are alternately stacked, and separated by a first slit; string pillars passing through the stack structures; and dummy holes passing through top portions of the stack structures to be spaced apart from bottom surface of the stack structures and disposed between the string pillars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.