Low-cost solar cell metallization over TCO and methods of their fabrication

US9577140B2 · kind B2 · utility

Assignee

• SUNPREME · KY

Inventors

• Ashok Sinha · Palo Alto, US
• Roman Milter · San Francisco, US
• Robert Broesler · San Francisco, US

Key dates

• Filing date: May 12, 2015
• Grant date: Feb 21, 2017
• Expiry date: May 12, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/547

Abstract

Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.