Ashok Sinha
92Patents
38h-index
161Co-inventors
91Inventor score
Filing activity: Sep 3, 1974 → Feb 8, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5855681A | Ultra high throughput wafer vacuum processing system | Electricity | 948 | Expired |
| US5846332A | Thermally floating pedestal collar in a chemical vapor deposition chamber | Electricity | 782 | Expired |
| US6129044A | Apparatus for substrate processing with improved throughput and yield | Electricity | 546 | Expired |
| US6136163A | Apparatus for electro-chemical deposition with thermal anneal chamber | Electricity | 440 | Expired |
| US5516367A | Chemical vapor deposition chamber with a purge guide | Emerging Cross-Sectional Technologies | 349 | Expired |
| US6189482A | High temperature, high flow rate chemical vapor deposition apparatus and related methods | Electricity | 340 | Expired |
| US6258220A | Electro-chemical deposition system | Electricity | 333 | Expired |
| US6170428A | Symmetric tunable inductively coupled HDP-CVD reactor | Electricity | 322 | Expired |
| US6258223A | In-situ electroless copper seed layer enhancement in an electroplating system | Electricity | 310 | Expired |
| US6551929B1 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Electricity | 286 | Expired |
| US4851370A | Fabricating a semiconductor device with low defect density oxide | Electricity | 270 | Expired |
| US5856240A | Chemical vapor deposition of a thin film onto a substrate | Emerging Cross-Sectional Technologies | 251 | Expired |
| US6176667A | Multideck wafer processing system | Emerging Cross-Sectional Technologies | 243 | Expired |
| US6277249A | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Electricity | 195 | Expired |
| US6274008A | Integrated process for copper via filling | Electricity | 155 | Expired |
| US6939804B2 | Formation of composite tungsten films | Electricity | 90 | Expired |
| US4378628A | Cobalt silicide metallization for semiconductor integrated circuits | Electricity | 87 | Expired |
| US4142004A | Method of coating semiconductor substrates | Electricity | 82 | Expired |
| US5695568A | Chemical vapor deposition chamber | Emerging Cross-Sectional Technologies | 80 | Expired |
| US6109206A | Remote plasma source for chamber cleaning | Emerging Cross-Sectional Technologies | 66 | Expired |
| US6890850B2 | Method of depositing dielectric materials in damascene applications | Electricity | 65 | Expired |
| US5292554A | Deposition apparatus using a perforated pumping plate | Electricity | 65 | Expired |
| US6451177B1 | Vault shaped target and magnetron operable in two sputtering modes | Electricity | 61 | Expired |
| US5476548A | Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring | Electricity | 57 | Expired |
| US4276557A | Integrated semiconductor circuit structure and method for making it | Emerging Cross-Sectional Technologies | 53 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.