Package carrier and manufacturing method thereof
US9578750B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2013 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Feb 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing of a package carrier includes the following steps. Two base metal layers are bonded together. Two supporting layers are laminated onto the base metal layers respectively. Two release metal films are disposed on the supporting layers respectively. Each release metal film includes a first metal film and a second metal film separable from each other. Two first patterned metal layers are formed on the release metal films respectively. Each first patterned metal layer includes a pad pattern. Two dielectric layers are formed on the release metal films respectively and cover the corresponding first patterned metal layers. Each dielectric layer has a conductive via connecting to the corresponding pad pattern. Two second patterned metal layers are formed on the dielectric layers respectively. Each second patterned metal layer at least covers the conductive via. The base metal layers are separated from each other to form two independent package carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.