Substrate processing apparatus and substrate processing method
US9583360B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 20, 2012 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a substrate processing apparatus, includes: a chamber; a first electrode disposed in the chamber; a second electrode disposed in the chamber to face the first electrode, and to hold a substrate; an RF power supply to apply an RF voltage with a frequency of 50 MHz or more to the second electrode; and a pulse power supply to repeatedly apply a voltage waveform including a negative voltage pulse and a positive voltage pulse of which delay time from the negative voltage pulse is 50 nano-seconds or less to the second electrode while superposing on the RF voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.