Processes and apparatus for preparing heterostructures with reduced strain by radial distension
US9583363B2 · kind B2 · utility
5Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2013 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Feb 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.