Semiconductor device
US9583413B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2009 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Jan 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.